Structural changes like deformations and crack growth in polymers, filled with electrically conductive particles can be measured by resistography. Accordingly, the polymeric adhesive layers in glued-laminated timber should be usable for characterization of the wooden structures and the integrity of the bondline. The described research of the last years – partly described on different conferences in 2012 to 2016, refined and extended - addresses the question, if electrically conductive adhesives can be used to characterize structural changes of wooden structures. Electrical conductive adhesives have been modified with carbon based fillers to use the bondline as a sensor in layered wood structures. Laboratory scaled samples were prepared and tested in different load and climate conditions to proof the usability of the conductive adhesive for measurement purposes. The results are showing a correlation between displacement and DC resistivity. Further, the signals also allow a separation among the different kinds of stress states. By varying the contact points of the resistivity measurement it was also possible to monitor the wood moisture.